PRINTED BOARD ASSEMBLY PRODUCTS - MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY - PART 2: GENERIC REQUIREMENTS
International Electrotechnical Committee
FOREWORD
1 Scope and object
1.1 Focus and intent
1.2 Notation
2 Normative references
3 Documentation conventions
4 Requirements
4.1 Rules concerning the use of XML and XML Schema
4.2 Data organization and identification rules
4.3 Transformation characteristics (Xform)
4.4 Substitution groups
5 Content
5.1 Content: FunctionMode
5.2 Function levels
5.3 Content: StepListRef
5.4 Content: LayerDescRef
5.5 Content: BomRef
5.6 Content: AvlRef
5.7 Content: DictionaryStandard
5.8 Content: DictionaryUser
5.9 Content: DictionaryFont
5.10 Content: DictionaryLineDesc
5.11 Content: DictionaryColor
5.12 Content: DictionaryFirmware
6 Logistic header
6.1 LogisticHeader
6.2 Role
6.3 Enterprise
6.4 Person
7 History record
7.1 HistoryRecord
7.2 FileRevision
7.3 SoftwarePackage
7.4 ChangeRec
8 BOM (Material List)
8.1 BOM Header
8.2 BomItem
9 Electronic computer aided design (ecad)
9.1 CadHeader
9.2 CadData/LayerDesc
9.3 CadData/StepList
10 Approved vendor list (AVL)
10.1 AvlHeader
10.2 AvlItem
11 Glossary.
Annexe A (informative) IPC-7351 Naming Convention for Land
Patterns
Annexe B - Informative references
Specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 93 |
