ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE
International Electrotechnical Committee
FOREWORD
1 Scope
2 Basics
3 Boards under investigation
4 Temperature tolerances
5 Peak form and width
6 Classification
7 Consideration for a lead-free reflow
temperature profile
8 Conclusion
Bibliography
Provides as a Technical Report and presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
