IEC 61188-5-5 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 General information<br>&nbsp;&nbsp;3.1 General component description<br>&nbsp;&nbsp;3.2 Marking<br>&nbsp;&nbsp;3.3 Carrier packaging format<br>&nbsp;&nbsp;3.4 Process considerations<br>4 PQFP (square)<br>&nbsp;&nbsp;4.1 Field of application<br>&nbsp;&nbsp;4.2 Component descriptions<br>&nbsp;&nbsp;4.3 Component dimensions<br>&nbsp;&nbsp;4.4 Solder joint fillet design<br>&nbsp;&nbsp;4.5 Land pattern dimensions<br>5 PQFP (rectangular)<br>&nbsp;&nbsp;5.1 Field of application<br>&nbsp;&nbsp;5.2 Component descriptions<br>&nbsp;&nbsp;5.3 Component dimensions<br>&nbsp;&nbsp;5.4 Solder joint fillet design<br>&nbsp;&nbsp;5.5 Land pattern dimensions<br>6 PLQFP (square)<br>&nbsp;&nbsp;6.1 Field of application<br>&nbsp;&nbsp;6.2 Component descriptions<br>&nbsp;&nbsp;6.3 Component dimensions<br>&nbsp;&nbsp;6.4 Solder joint fillet design<br>&nbsp;&nbsp;6.5 Land pattern dimensions<br>7 PLQFP (rectangular)<br>&nbsp;&nbsp;7.1 Field of application<br>&nbsp;&nbsp;7.2 Component descriptions<br>&nbsp;&nbsp;7.3 Component dimensions<br>&nbsp;&nbsp;7.4 Solder joint fillet design<br>&nbsp;&nbsp;7.5 Land pattern dimensions<br>8 PTQFP (square)<br>&nbsp;&nbsp;8.1 Field of application<br>&nbsp;&nbsp;8.2 Component descriptions<br>&nbsp;&nbsp;8.3 Component dimensions<br>&nbsp;&nbsp;8.4 Solder joint fillet design<br>&nbsp;&nbsp;8.5 Land pattern dimensions

Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 91