SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Test apparatus and components
4.1 Test apparatus
4.2 Test components
4.3 Test board
4.4 Test board assembly
4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
5.2 Pre-test characterization
5.3 Drop testing
6 Failure criteria and failure analysis
7 Summary
Annex A (informative) Preferred board construction,
material, design and layout
Bibliography
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
