IEC 62047-4 : 1.0

Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, units and symbols
4 Standard environmental conditions
5 Marking
  5.1 Device identification
  5.2 Device traceability
  5.3 Packing
6 Quality assessment procedures
  6.1 General
      6.1.1 Eligibility for qualification and/or capability
            approval
      6.1.2 Primary stage of manufacture
      6.1.3 Formation of inspection lots
      6.1.4 Structurally similar device
      6.1.5 Subcontracting
      6.1.6 Incorporated components
      6.1.7 Validity of release
  6.2 Qualification approval procedure
      6.2.1 Qualification approval testing
      6.2.2 Environmental and climatic tests
      6.2.3 Granting of qualification approval
      6.2.4 Statistical sampling procedures
      6.2.5 Endurance tests
      6.2.6 Endurance tests where the failure rate is
            specified
      6.2.7 Accelerated test procedures
7 Test and measurement procedures
  7.1 Standard conditions and general precautions
      7.1.1 Standard conditions
      7.1.2 General precautions
      7.1.3 Precision of measurements
  7.2 Physical examination
      7.2.1 Visual examination
      7.2.2 Dimensions
  7.3 Climatic and mechanical tests
  7.4 Alternative test methods
Annex A (normative) Sampling procedures
Annex B (informative) Classification for MEMS technologies
        and devices
Bibliography

Abstract

Describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS applications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47