SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment and material
4.1 Test equipment for cyclic bending
4.2 Test substrate
4.3 Solder alloy
4.4 Solder paste
4.5 Reflow soldering equipment
4.6 Surface mount component for testing
5 Mounting method
6 Test conditions
6.1 Pre-treatment
6.2 Test procedures
6.3 Judging criteria
7 Items to be included in the test report
8 Items to be prescribed in the product specifications
Annex A (normative) Cyclic bending test equipment
Applicable to surface mount components with a thin and wide basal plane, such as QFP and BGA.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
