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IEC 62137-1-5 : 1.0

IEC 62137-1-5 : 1.0

SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Test equipment and materials<br>&nbsp;&nbsp;4.1 Test equipment for mechanical shear fatigue testing<br>&nbsp;&nbsp;4.2 Test substrate<br>&nbsp;&nbsp;4.3 Solder alloy<br>&nbsp;&nbsp;4.4 Solder paste<br>&nbsp;&nbsp;4.5 Reflow soldering equipment<br>5 Mounting<br>6 Test conditions<br>&nbsp;&nbsp;6.1 Pre-treatment<br>&nbsp;&nbsp;6.2 Test procedures<br>&nbsp;&nbsp;6.3 Judging criteria<br>7 Items to be included in the test report<br>8 Items to be given in the product specification<br>Annex A (normative) Mechanical shear fatigue test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;equipment<br>Annex B (normative) Mechanical shear fatigue test<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;procedure<br>Annex C (informative) Evaluation of mechanical properties <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;of a single solder joint by mechanical shear <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;fatigue test<br>Bibliography

Abstract

Describes a test method that applies to area array packages, such as BGA.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

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