IEC 60749-20-1 : 1.0

Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 General applicability and reliability considerations<br>&nbsp;&nbsp;4.1 Assembly processes<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.1.1 Mass reflow<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.1.2 Localized heating<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.1.3 Socketed components<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;4.1.4 Point-to-point soldering<br>&nbsp;&nbsp;4.2 Reliability<br>5 Dry packing<br>&nbsp;&nbsp;5.1 Requirements<br>&nbsp;&nbsp;5.2 Drying of SMDs and carrier materials before being <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;sealed in MBBs<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.2.1 Drying requirements - level A2<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.2.2 Drying requirements - levels B2a to B5a<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.2.3 Drying requirements - carrier materials<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.2.4 Drying requirements - other<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.2.5 Excess time between bake and bag<br>&nbsp;&nbsp;5.3 Dry pack<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.3.1 Description<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.3.2 Materials<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.3.3 Labels<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;5.3.4 Shelf life<br>6 Drying<br>&nbsp;&nbsp;6.1 Drying options<br>&nbsp;&nbsp;6.2 Post exposure to factory ambient<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.1 Floor life clock<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.2 Any duration exposure<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.2.3 Short duration exposure<br>&nbsp;&nbsp;6.3 General considerations for baking<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.1 High-temperature carriers<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.2 Low-temperature carriers<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.3 Paper and plastic container items<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.4 Bakeout times<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.5 ESD protection<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.6 Reuse of carriers<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;6.3.7 Solderability limitations<br>7 Use<br>&nbsp;&nbsp;7.1 Floor life clock start<br>&nbsp;&nbsp;7.2 Incoming bag inspection<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.2.1 Upon receipt<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.2.2 Component inspection<br>&nbsp;&nbsp;7.3 Floor life<br>&nbsp;&nbsp;7.4 Safe storage<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.4.1 Safe storage categories<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.4.2 Dry pack<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.4.3 Dry atmosphere cabinet<br>&nbsp;&nbsp;7.5 Reflow<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.1 Reflow categories<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.2 Opened MBB<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.3 Reflow temperature extremes<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.4 Additional thermal profile parameters<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.5 Multiple reflow passes<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.5.6 Maximum reflow passes<br>&nbsp;&nbsp;7.6 Drying indicators<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.6.1 Drying requirements<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.6.2 Excess humidity in the dry pack<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.6.3 Floor life or ambient temperature/humidity exceeded<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;7.6.4 Level B6 SMDs<br>Annex A (normative) Symbol and labels for moisture-sensitive <br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;devices<br>Annex B (informative) Board rework<br>Annex C (informative) Derating due to factory environmental<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;conditions <br>Bibliography

Abstract

Applicable to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 47
Supersedes	IEC PAS 62169 : 1.0 IEC PAS 62168 : 1.0