SAFETY OF MACHINERY - ELECTRICAL EQUIPMENT OF MACHINES - PART 33: REQUIREMENTS FOR SEMICONDUCTOR FABRICATION EQUIPMENT
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Incoming supply conductor terminations and devices for
disconnecting and switching off
6 Protection against electric shock
7 Protection of equipment
8 Equipotential bonding
9 Control circuits, emergency off (EMO), and protective
interlock circuits
10 Operator interfaces
11 Controlgear: location, mounting, and enclosures
12 Conductors and cables
13 Wiring practices
14 Electric motors and associated equipment
15 Accessories and lighting
16 Marking, warning signs and reference designations
17 Technical documentation
18 Testing
Annex A (normative) - Basic protection (protection against
indirect contact) in TN-systems
Annex B (normative) - Protection against indirect contact in
TT-systems (Derived from
IEC 60364-4-41:2005 and IEC 60364-6:2006)
Annex C (normative) - Conductor ampacity, and creepage and
clearance distances
Annex D (normative) - Standard test fingers
Annex E (informative) - Types of system earthing (Derived from
IEC 60364-1: 2005)
Bibliography
Pertains to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 44 |
