SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
International Electrotechnical Committee
FOREWORD<br>1 Scope and object<br>2 Normative references<br>3 Terms and definitions<br>4 Requirements to component design and component <br> specifications<br>5 Specification of assembly process conditions<br>6 Typical process conditions<br>7 Requirements for components and component specifications <br> for THR soldering processes
Provides a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
