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IEC 60191-6-21 : 1.0

IEC 60191-6-21 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods

Abstract

Describes methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47

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