Specials

All specials

Home>IEC 60191-6-17 : 1.0

IEC 60191-6-17 : 1.0

IEC 60191-6-17 : 1.0

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-17: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR STACKED PACKAGES - FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (P-PFBGA AND P-PFLGA)

International Electrotechnical Committee

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$34.32

$78.00

(price reduced by 56 %)

Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table

Abstract

Specifies outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47D

Contact us