SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Measurement methods<br>Annex A (informative) - Example of bonding force <br>Annex B (informative) - An example of the fabrication <br> process for three-point bending specimens <br>Bibliography
Specifies bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
