SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an
external drive and a device with an integrated strain
gauge for detecting displacement
Annex C (informative) - Example of electromagnetic
drive out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on
fatigue life of brittle materials based on Paris' law
and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Describes a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
