ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 General remarks<br>5 Procedure of selecting the applicable test method<br>6 Common subjects in each test method<br>7 Evaluation test method<br>Annex A (informative) - Condition of rapid temperature <br> change <br>Annex B (informative) - Electrical continuity test for <br> solder joint<br>Annex C (informative) - Torque shear strength test <br>Annex D (informative) - Monotonic bending strength test<br>Annex E (informative) - Cyclic steel ball drop strength test<br>Annex F (informative) - Pull strength test<br>Annex G (informative) - Creep strength test<br>Annex H (informative) - Evaluation method for the fillet lifting <br> phenomenon of a lead insertion type device solder joint<br>Bibliography
Defines the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
| Supersedes |
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