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IEC 62047-14 : 1.0

IEC 62047-14 : 1.0

SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 14: FORMING LIMIT MEASURING METHOD OF METALLIC FILM MATERIALS

International Electrotechnical Committee

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Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Testing method
5 Test procedure and analysis
6 Test report
Annex A (informative) - Principles of the forming limit
        diagram
Annex B (informative) - Grid marking method
Annex C (informative) - Gripping method
Annex D (informative) - Strain measuring method

Abstract

Defines definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 [mu]m to 300 [mu]m.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 47

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