SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND - AND SHEAR - TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
Defines the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
