PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Symbols and abbreviated terms<br>5 Objectives<br>6 Technical requirements<br>7 Plan administrative requirements<br>Annex A (informative) - Template for tailoring <br> requirements of IEC/TS 62647-1<br>Annex B (informative) - Requirements matrix <br> for IEC/TS 62647-1 <br>Annex C (informative) - Guidance on configuration control <br> and product identification <br>Bibliography
Specifies the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
