IEC 60191-6-22 : 1ED 2012

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-22: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR SEMICONDUCTOR PACKAGES SILICON FINE-PITCH BALL GRID ARRAY AND SILICON FINE-PITCH LAND GRID ARRAY (S-FBGA AND S-FLGA)

International Electrotechnical Committee

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions
8 Combination list of D, E, M[D], and M[E]
Bibliography

Abstract

Specifies the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).