PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 2: MITIGATION OF DELETERIOUS EFFECTS OF TIN
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Technical requirement
Annex A (informative) - Guidance on control levels,
risk assessment, and mitigation evaluation
Annex B (informative) - Technical guide on detection
methods, mitigation methods, and methods
for limiting impact of tin
Annex C (informative) - Tin whisker inspection
Annex D (informative) - Analysis and risk assessment
guidance
Annex E (informative) - Whiskers growing from solder
joint fillets and bulk solder
Bibliography
Defines the processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
