PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS CAPABILITY IN OPERATION - PART 1: TEMPERATURE UPRATING
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Selection provisions
Annex A (informative) - Device parameter re-characterisation
Annex B (informative) - Stress balancing
Annex C (informative) - Parameter conformance assessment
Annex D (informative) - Higher assembly level testing
Bibliography
Gives information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
