PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 21: PROGRAM MANAGEMENT - SYSTEMS ENGINEERING GUIDELINES FOR MANAGING THE TRANSITION TO LEAD-FREE ELECTRONICS
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms, definitions and abbreviations<br>4 General discussion of program management/systems <br> engineering management concerns<br>5 Requirements definition<br>6 Use environment(s)<br>7 Decision criteria<br>8 Supplier's lead-free control plan<br>9 Requalification/test plan<br>10 Rework/repair and maintenance<br>11 Risk management<br>12 Cost<br>13 Presentation to customer<br>Annex A (informative) - Matrix of tier level <br> versus associated risk <br>Annex B (informative) - Links to the European Union <br> Directives and Executive Order 13148 <br>Annex C (informative) - General program manager <br> checklist for dealing with Pb-free issues <br>Annex D (informative) - General manufacturing process <br> assessment checklist for assessing supplier <br> compliance to IEC/TS 62647-1 <br>Annex E (informative) - Recommended program language <br> (subject to contractual agreements)<br>Bibliography
Defines the program management and/or systems engineering management in managing the transition to lead-free (Pb-free) electronics to assure product reliability and performance.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
