ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES ON SEMICONDUCTOR DEVICES
International Electrotechnical Committee
1 Scope<br>2 Terms and definitions<br>3 Test method for measuring tin whisker <br> growth<br>4 Acceptance procedure for tin and tin alloy <br> surface finishes<br>5 Acceptance criteria<br>6 Reporting of results<br>7 On-going tin whisker evaluation<br>Annex A (normative) - Test method for measuring <br> whisker growth on tin and tin alloy<br> surface finishes of semiconductor devices<br>Bibliography
Specifies the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
| Supersedes |
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