IEC 62483 : 1ED 2013
IEC 62483 : 1ED 2013
ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES ON SEMICONDUCTOR DEVICES
International Electrotechnical Committee
ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHES ON SEMICONDUCTOR DEVICES
International Electrotechnical Committee
1 Scope<br>2 Terms and definitions<br>3 Test method for measuring tin whisker <br> growth<br>4 Acceptance procedure for tin and tin alloy <br> surface finishes<br>5 Acceptance criteria<br>6 Reporting of results<br>7 On-going tin whisker evaluation<br>Annex A (normative) - Test method for measuring <br> whisker growth on tin and tin alloy<br> surface finishes of semiconductor devices<br>Bibliography
Specifies the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices.
Document Type | Standard |
Status | Current |
Publisher | International Electrotechnical Committee |
Committee | TC 47 |
Supersedes |
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