PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope <br>2 Normative references <br>3 Terms, definitions and abbreviations<br>4 Pb-free concerns<br>5 Materials<br>6 Soldering equipment<br>7 General rework/repair considerations<br>8 Pre-rework/repair processes<br>9 Rework/repair processes<br>10 Post-rework/repair processes<br>Annex A (informative) - Termination finishes<br>Annex B (informative) - Tin whiskers<br>Bibliography
Gives technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
