PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
International Electrotechnical Committee
FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms, definitions and abbreviations<br>4 Assumption<br>5 Default test methods<br>6 Protocol to design and conduct performance tests<br>7 Final remarks <br>Annex A (informative) - Test sample size<br>Annex B (informative) - Material properties of lead-free <br> solder materials <br>Annex C (informative) - NASA-DoD lead-free electronics <br> project test information<br>Bibliography
Specifies for circuit card assemblies (CCA): - a default method for those companies that require a pre-defined approach, and - a protocol for those companies that wish to develop their own test methods.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 107 |
