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IEC TR 62866 : 1ED 2014

IEC TR 62866 : 1ED 2014

ELECTROCHEMICAL MIGRATION IN PRINTED WIRING BOARDS AND ASSEMBLIES - MECHANISMS AND TESTING

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope <br>2 Electrochemical migration<br>3 Test conditions and specimens<br>4 Test methods<br>5 Electrical tests<br>6 Evaluation of failures and analysis<br>Annex A (informative) - Life evaluation<br>Annex B (informative) - Measurement of temperature-humidity<br>Bibliography

Abstract

Defines the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

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