ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
International Electrotechnical Committee
FOREWORD
1 Scope
2 Normative references
3 Terms definitions and abbreviations
4 General
5 Test apparatus and materials
6 Specimen preparation
7 Temperature cycling test
8 Temperature cycling life
9 Items to be specified in the relevant product
specification
Annex A (informative) - Acceleration of the temperature
cycling for solder joints
Annex B (informative) - Electrical continuity test for
solder joints of the package
Annex C (informative) - Reflow solderability test method
for package and test substrate land
Annex D (informative) - Test substrate design guideline
Annex E (informative) - Heat resistance to reflow soldering
for test substrate
Annex F (informative) - Pull strength measurement method
for the test substrate land
Annex G (informative) - Standard mounting process for the
packages
Annex H (informative) - Mechanical stresses to the packages
Bibliography
Defines the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
