TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 X: Miscellaneous test methods
Annex A (informative) - Typical comparison of particle
size distributions between laser diffraction
method and screen method
Bibliography
Specifies test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
