Home>IEC 61189-3-719 : 1ED 2016

IEC 61189-3-719 : 1ED 2016

IEC 61189-3-719 : 1ED 2016

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-719: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) - MONITORING OF SINGLE PLATED-THROUGH HOLE (PTH) RESISTANCE CHANGE DURING TEMPERATURE CYCLING

International Electrotechnical Committee

More details

Download

PDF AVAILABLE FORMATS IMMEDIATE DOWNLOAD
$31.20

$78.00

(price reduced by 60 %)

Table of Contents

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test specimens
5 Test apparatus
6 Procedure
7 Report
8 Additional information
Bibliography

Abstract

Defines a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

Contact us