SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 25: SILICON BASED MEMS FABRICATION TECHNOLOGY - MEASUREMENT METHOD OF PULL-PRESS AND SHEARING STRENGTH OF MICRO BONDING AREA
International Electrotechnical Committee
FOREWORD<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Requirements<br>5 Testing method<br>Annex A (informative) - Dimensions for testing<br> structure and tensile/compressive strength<br>Annex B (informative) - Pull-press testing method<br> example
Defines the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
