SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 27: BOND STRENGTH TEST FOR GLASS FRIT BONDED STRUCTURES USING MICRO-CHEVRON-TESTS (MCT)
International Electrotechnical Committee
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols and abbreviated terms
4 Principle
5 Test setup
6 Specimens
7 Conduction of the test
8 Test parameter
9 Analysis and evaluation
10 Test report
Bibliography
Describes a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
