Home>IEC TR 61189-3-914 : 1ED 2017

IEC TR 61189-3-914 : 1ED 2017

IEC TR 61189-3-914 : 1ED 2017

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3-914: TEST METHOD FOR THERMAL CONDUCTIVITY OF PRINTED CIRCUIT BOARDS FOR HIGH-BRIGHTNESS LEDS - GUIDELINES

International Electrotechnical Committee

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Table of Contents

FOREWORD<br>INTRODUCTION<br>1 Scope<br>2 Normative references<br>3 Terms and definitions<br>4 Test condition<br>5 Pre-condition<br>6 Heat dissipation characteristics<br>Annex A (informative) - Classification and class of<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;the PCB<br>Annex B (informative) - Measurement comparison<br>&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;between companies (plane)

Abstract

Describes the detailed procedures and precautions for IEC 61189-3-913.

General Product Information

Document Type Standard
Status Current
Publisher International Electrotechnical Committee
Committee TC 91

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