TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS
International Electrotechnical Committee
FOREWORD<br>1 Scope <br>2 Normative references <br>3 Terms and definitions <br>4 Testing condition<br>5 Specimen <br>6 Equipment/Apparatus or material<br>7 Resistance measurement method <br>8 Test method <br>9 Procedure <br>Annex A (informative) - Forms of electrochemical migration<br>Bibliography
Describes the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
