IEC 62979 : 1ED 2017

Table of Contents

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Thermal runaway test
5 Pass or fail criteria
6 Test report

Abstract

Gives a method for evaluating whether a bypass diode as mounted in the module is susceptible to thermal runaway or if there is sufficient cooling for it to survive the transition from forward bias operation to reverse bias operation without overheating.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
Pages
ISBN
Committee	TC 82