MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-45: REINFORCED BASE MATERIALS CLAD AND UNCLAD - NON-HALOGENATED EPOXIDE NON-WOVEN/WOVEN E-GLASS REINFORCED LAMINATE SHEETS OF THERMAL CONDUCTIVITY 1,0 W/(M*K) AND DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
International Electrotechnical Committee
FOREWORD<br>1 Scope <br>2 Normative references<br>3 Terms and definitions<br>4 Materials and construction<br>5 Electrical properties<br>6 Non-electrical properties of the copper-clad laminate<br>7 Non-electrical properties of the base material after<br> complete removal of the copper foil<br>8 Quality assurance <br>9 Packaging and marking <br>10 Ordering information <br>Annex A (informative) - Engineering information<br>Annex B (informative) - Common laminate constructions<br>Annex C (informative) - Guideline for qualification and<br> conformance inspection<br>Bibliography
Provides requirements for properties of non-halogenated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of thermal conductivity and defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 91 |
