IEC 63011-2:2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

International Electrotechnical Committee

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Abstract

This part of IEC 63011 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	International Electrotechnical Committee
ProductNote	THIS STANDARD ALSO REFERS TO IEC 63011-1, IEC 63011-3
Pages
ISBN
Committee	TC 47