Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
International Electrotechnical Committee
This part of IEC 63011 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC)to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
| Document Type | Standard |
| Status | Current |
| Publisher | International Electrotechnical Committee |
| Committee | TC 47 |
