IEEE 1156.2 : 1996

Table of Contents

1 Overview
  1.1 Scope
  1.2 Purpose
2 References
3 Terminology
4 Performance level qualification
5 Common testing conditions
  5.1 Normal operation
  5.2 Maximum power
  5.3 Mounting
  5.4 Test duration
  5.5 Initial and final measurements
6 Non-operating environmental core conditions
  6.1 Low Temperature (non-operating/storage)
  6.2 High temperature (non-operating/storage)
  6.3 Thermal shock (non-operating/storage)
  6.4 Humidity (non-operating/storage)
  6.5 Free fall (non-operating/storage)
  6.6 Vibration (non-operating/storage)
  6.7 Shock (non-operating/storage)
  6.8 Mixed flowing gas corrosion (non-operating/
       storage
  6.9 Fungus (non-operating/storage)
  6.10 Flammability (non-operating/storage)
  6.11 Electrostatic discharge (ESD)(non-operating/
       storage)
7 Operating environmental conditions
  7.1 Low temperature (operating)
  7.2 High temperature (operating)
  7.3 Sinusoidal vibration (operating)
  7.4 Shock (operating)
  7.5 Low air pressure (operating)
  7.6 Electrostatic discharge (ESD)(operating)
  7.7 Electromagnetic induction (EMI)(operating)
  7.8 Earthquake protection
Annex A (informative) Thermal testing of forced
                      convection-cooled modules
Annex B (informative) Shock and vibration fixtures

Abstract

Contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. Provides general environmental withstand conditions for one or more of the above listed computer busses or interconnect standards, and electronic equipment in general. Purpose is to provide a core specification for physical integrity and environmental performance levels for computer systems.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Institute of Electrical & Electronics Engineers
Pages
ISBN
Supersedes	IEEE DRAFT 1156.2 : D3 JUN 94