JIS Z 3198-7:2003
JIS Z 3198-7:2003
Test methods for lead-free solders Part 7: Methods for shear strength of solder joints on chip components
Japanese Standards Association
Specials
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SAE J 1058 : 2015
$78.00 (-56%) $34.32
Table of Contents
Abstract
This Standard specifies test methods for shear strength of solder joints on chip components by using lead-free solder to be used principally for wiring connection of electrical machining and apparatus, electronic apparatus, communication equipment or the like, wiring connection of components and the like.
General Product Information
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |
