Test methods for lead-free solders Part 4: Methods for solderbility test by a wetting balance method and a contact angle method
Japanese Standards Association
This Standard specifies the methods for solderability test of a wetting balance method and a contact angle method of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |
