JIS Z 3198-3:2003

JIS Z 3198-3:2003

Test methods for lead-free solders Part 3: Methods for spread test

Japanese Standards Association

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Abstract

This Standard specifies the method of spread test of lead-free solder to be used principally for wiring connection, parts connection and the like of electrical machinery and apparatus, electronic apparatus, communication equipment and the like.

General Product Information

Document Type Standard
Status Current
Publisher Japanese Standards Association

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