Connectors for electronic equipment - Tests and measurements Part 6-2: Dynamic stress tests - Test 6b: Bump
Japanese Standards Association
This section of JIS C 5402-6 is to define a standard test method to assess the ability of components to withstand specified severities of bump. This test may also be used for similar devices when specified in a detail specification.
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |
