JIS C 60068-2-69:2009

JIS C 60068-2-69:2009

Environmental testing Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Japanese Standards Association

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Abstract

This Japanese Industrial Standard specifies test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices (SMD).

General Product Information

Document Type Standard
Status Current
Publisher Japanese Standards Association

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