JIS Z 3198-1:2014

Table of Contents

Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of test
5 Test equipment and apparatus
6 Calibration of the temperature
7 Procedure for the measuring method
8 Test report
Annex A (normative) - Test report on melting
        temperatures of solder alloys
Annex JA (informative) - Comparison table between
         JIS and corresponding International Standard

Abstract

Describes the methods for measuring of melting temperature ranges of lead-free solders that are mainly used for wiring of electric, electrical and communication equipment, and for other apparatus, as well as connecting components.

General Product Information

Published
Document Type	Standard
Status	Current
Publisher	Japanese Standards Association
Pages
ISBN
Supersedes	JIS Z 3198-1:2003