JIS Z 3284-4:2014
JIS Z 3284-4:2014
Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread
Japanese Standards Association
Solder Paste - Part 4: Test Methods For Wettability, Solderball And Spread
Japanese Standards Association
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex A (normative) - Characteristics evaluation table of
solder paste
Annex JA (informative) - Comparison table between JIS
and corresponding International Standard
Defines the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Document Type | Standard |
Status | Current |
Publisher | Japanese Standards Association |
ProductNote | Supersedes JIS Z3284. (06/2014) |
Supersedes |
|