Solder Paste - Part 2: Test Methods For Solder Particle Shape, Surface Condition Judgment, And Particle Size Distribution
Japanese Standards Association
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex A (normative) - Characteristics evaluation table of
solder paste
Annex JA (informative) - Comparison table between JIS
and corresponding International Standard
Describes the shape, surface condition judgment test and particle size distribution measurement test of the solder particles of solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |
| ProductNote | Supersedes JIS Z3284. (06/2014) |
| Supersedes |
|
