JIS Z 3284-3:2014
JIS Z 3284-3:2014
Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness
Japanese Standards Association
Solder Paste - Part 3: Test Methods For Printability, Viscosity, Slump And Tackiness
Japanese Standards Association
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
Annex JA (normative) - Characteristics evaluation table
of solder paste
Annex JB (informative) - Comparison table between JIS
and corresponding International Standard
Describes the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
Document Type | Standard |
Status | Current |
Publisher | Japanese Standards Association |
ProductNote | Supersedes JIS Z3284. (06/2014) |
Supersedes |
|