Environmental Testing - Part 2-58: Tests - Test Td: Test Methods For Solderability, Resistance To Dissolution Of Metallization And To Soldering Heat Of Surface Mounting Devices (smd)
Japanese Standards Association
Introduction
1 Scope
2 Normative references
3 Definitions
4 Pre-conditioning
5 Solder bath method
5.1 Test apparatus and materials for the solder
bath method
6 Procedure for solder bath method
6.1 Number of specimens
6.2 Clamping
6.3 Fluxing
6.4 Solder immersion
7 Solder reflow methods
7.1 Test apparatus and materials
8 Test procedure of reflow method
8.1 Number of specimens
8.2 Application of solder paste
8.3 Placement of specimens
8.4 Pre-heating
8.5 Solder reflow
9 Flux removal
9.1 Recovery
9.2 Evaluation
10 Information to be given in the relevant specification
Annex A (normative) - Criteria for visual examination
Annex B (informative) - Guidance
Annex 1 (informative) - Method of measuring temperature and
treatments of moisture soaking and
baking for semiconductor SMDs
Annex 2 (informative) - Comparison table between JIS and
corresponding international
standard
Outlines test Td, applicable to surface mounting devices (SMD). Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD).
| Document Type | Standard |
| Status | Current |
| Publisher | Japanese Standards Association |
| Supersedes |
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